Methods of forming semiconductor structures including tight pitch contacts and lines

ABSTRACT

Methods of fabricating semiconductor structures incorporating tight pitch contacts aligned with active area features and of simultaneously fabricating self-aligned tight pitch contacts and conductive lines using various techniques for defining patterns having sublithographic dimensions. Semiconductor structures having tight pitch contacts aligned with active area features and, optionally, aligned conductive lines are also disclosed, as are semiconductor structures with tight pitch contact holes and aligned trenches for conductive lines.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.14/275,414, filed May 12, 2014, now U.S. Pat. No. 8,994,189, issued Mar.31, 2015, which application is a continuation of U.S. patent applicationSer. No. 13/194,558, filed Jul. 29, 2011, now U.S. Pat. No. 8,723,326,issued May 13, 2014, which is a divisional of U.S. patent applicationSer. No. 11/833,386, filed Aug. 3, 2007, now U.S. Pat. No. 8,481,417,issued Jul. 9, 2013, the disclosure of each of which is herebyincorporated herein in its entirety by this reference.

TECHNICAL FIELD

Embodiments of the invention relate generally to integrated circuitfabrication techniques. More specifically, embodiments of the inventionrelate to fabrication of semiconductor structures incorporating reduced,or “tight,” pitch contacts in alignment with active area features and,optionally, associated conductive lines thereover.

BACKGROUND

As a consequence of many factors, including demand for increasedportability, computing power, memory capacity and energy efficiency inmodern electronics, integrated circuits as fabricated on semiconductorsubstrates are continuously being reduced in size. To facilitate thissize reduction, research continues into ways of reducing the sizes ofintegrated circuits' constituent elements. Non-limiting examples ofthose constituent elements include transistors, capacitors, electricalcontacts, lines, and other electronic component elements. The trend ofdecreasing feature size is evident, for example, in memory circuitsincorporated in devices such as dynamic random access memories (DRAMs),static random access memories (SRAMs), ferroelectric (FE) memories,electronically-erasable programmable read-only memories (EEPROMs), Flashmemories, etc.

A NAND Flash memory chip, for example, conventionally comprises billionsof identical circuit elements, known as memory cells, arranged in aplurality of arrays with associated logic circuitry. Each memory celltraditionally stores one bit of information, although multi-level celldevices can store more than one bit per cell. Each such memory cellcomprises an addressable location that can store one bit (binary digit)of data. A bit can be written to a cell and read to retrieve the storedinformation. By decreasing the sizes of constituent elements, theconducting lines that connect them, and the conductive contacts carryingcharge between them, the sizes of the elements incorporating thesefeatures can be decreased. Storage capacities and circuit speed can beincreased by fitting more memory cells into a given area on the activesurface of the memory device.

The continual reduction in sizes of features from which the foregoingelements are fabricated places ever-greater demands on techniques usedto form the features. For example, photolithography is commonly used topattern features on a substrate. The concept of “pitch” can be used todescribe the sizing of these features. Pitch is the distance betweenidentical points in two adjacent repetitive features. The spaces betweenadjacent features may be filled by another material, such as adielectric. As a result, pitch can be viewed as the sum of the width ofa feature and of the width of the space separating that feature from aneighboring feature, when that neighboring feature is part of arepeating or periodic pattern, such as may occur, for example, in anarray of features.

Photoresist materials may be conventionally formulated to respond onlyto selected wavelengths of light. One common range of wavelengths thatcan be used lies in the ultraviolet (UV) range. Because many photoresistmaterials respond selectively to particular wavelengths,photolithography techniques each have a minimum pitch dictated by thewavelength, below which that particular photolithographic techniquecannot reliably form features. Thus, the minimum pitch achievable usinga particular photoresist can limit the capability for feature sizereduction.

Pitch reduction techniques, often somewhat erroneously termed “pitchmultiplication” as exemplified by “pitch doubling,” etc., can extend thecapabilities of photolithography beyond the feature size limitationsdictated by photoresists to allow creation of smaller, more denselyarranged features. That is, conventional “multiplication” of pitch by acertain factor actually involves reducing the pitch by that factor. Infact, “pitch multiplication” increases the density of features byreducing pitch. Pitch thus has at least two meanings: the linear spacingbetween identical features in a repeating pattern; and the density ornumber of features per given or constant linear distance. Thisconventional terminology is retained herein.

Examples of such methods are described in U.S. Pat. No. 5,328,810,issued to Lowrey et al., and U.S. Patent Application Publication No.2007/0049035, to Luan C. Tran, the entire disclosure of each of whichdocument is incorporated herein by reference.

The critical dimension (CD) of a mask scheme or corresponding circuitelement to be implemented on a given semiconductor material-basedintegrated circuit at a particular level is the scheme's minimum featuredimension, or the measurement of the smallest width of the smallestfeature that exists in that scheme or element. Due to factors such asgeometric complexity and different requirements for critical dimensionsin different parts of an integrated circuit, not all features of theintegrated circuit may be pitch multiplied. Furthermore, conventionalpitch multiplication entails additional steps relative to conventionallithography, which can involve considerable additional time and expense.However, if some features of an integrated circuit are pitch multiplied,it is inconvenient if connecting features that interface with thosefeatures are not also pitch multiplied. Thus, superimposed features thatare configured to contact each other are advantageously of similardimensions. Such similar dimensions can enable smaller and moreefficient operative components on an integrated circuit, thus increasingfeature density and decreasing chip size.

Conventional methods of forming contacts through insulating materials tocreate electrical connections between circuit layers at different levelshave not allowed the density of contacts to match the density of thefeatures intended to be connected thereby. Accordingly, there is a needfor methods of forming contacts with reduced dimensions and pitch thatcan match the density of the features intended to be connected by thosecontact features, especially where pitch multiplication is used to formthe features to be connected.

Furthermore and as noted above, there is a need for a reduction in thesize of integrated circuits and an increased operable density of thearrays of electrical elements on computer chips. Accordingly, a needexists for improved methods of forming features with reduced criticaldimensions relative to conventional methods; improved methods forincreasing feature density; methods that will produce more efficientarrays; methods that will provide more compact arrays without harmingfeature resolution; and methods that simplify or eliminate acts in thecreation of reduced-size features.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

In the drawings, which depict various embodiments of the presentinvention:

FIGS. 1A-1D are partial views of an embodiment of a semiconductor deviceof the present invention;

FIG. 2A is a partial top plan view of a workpiece that may be formedaccording to embodiments of methods of the present invention for formingsemiconductor devices like that shown in FIGS. 1A-1D;

FIG. 2B is a partial cross-sectional side view of the workpiece shown inFIG. 2A taken along section line 2B-2B shown therein;

FIG. 2C is a partial cross-sectional side view of the workpiece shown inFIG. 2A taken along section line 2C-2C shown therein;

FIGS. 3-5 are partial cross-sectional side views of additionalworkpieces that may be formed from the workpiece shown in FIGS. 2A-2C,the cross-sectional view being taken in a plane comprising section line2B-2B shown in FIG. 2A;

FIG. 6A is a partial cross-sectional side view of an additionalworkpiece that may be formed from the workpiece shown in FIGS. 2A-2C,the cross-sectional view being taken in a plane comprising section line2B-2B shown in FIG. 2A; and

FIG. 6B is a partial cross-sectional side view of the additionalworkpiece shown in FIG. 6A taken in a plane comprising section line2C-2C shown in FIG. 2A.

DETAILED DESCRIPTION

Embodiments of the present invention include semiconductor structures inwhich tight, or pitch-multiplied contacts are formed in alignment withunderlying features of an active area of a semiconductor structure. Inan embodiment, a tight pitch contact and aligned conductive line areconcurrently formed. As used herein, the term “tight” pitch refers to apitch and attendant feature size smaller than that which can be achievedusing conventional lithographic techniques absent pitch multiplication.Stated another way, a tight pitch may be characterized as asublithographic resolution pitch.

Embodiments of the present invention may include any of the processes orstructures described in U.S. patent application Ser. No. 11/215,982, theentire disclosure of which is incorporated herein by reference, anddescribed in United States Patent Application Publication No.2007/0049035, to Luan C. Tran, now U.S. Pat. No. 7,829,262, issued Nov.9, 2010, the entire disclosure of which was previously incorporatedherein by reference.

Details of non-limiting embodiments of the present invention aredescribed hereinafter, with reference to the drawings.

As will be apparent to one of ordinary skill in the art, the variouslayers discussed herein with respect to fabrication of a semiconductorstructure may be formed by methods known to those of skill in the artand suitable for use with the material of a given layer. Examplesinclude, but are not limited to, spin-on techniques, spray-ontechniques, chemical vapor deposition (CVD), atomic layer deposition(ALD), physical vapor deposition (PVD), also termed “sputtering,” andrelated selective processes, such as selective CVD. By way of furthernon-limiting example, various vapor deposition processes, such aschemical vapor deposition, may be used to form hard mask layers. A lowtemperature chemical vapor deposition process may be used to deposit thehard mask layers or any other materials, e.g., spacer material, over amask layer, where the mask layer is typically formed of amorphouscarbon. Such low temperature deposition processes advantageously preventchemical or physical disruption of the amorphous carbon layer. Amorphouscarbon layers may be formed by chemical vapor deposition using ahydrocarbon compound, or mixtures of such compounds, as carbonprecursors. Examples of suitable precursors include propylene, propyne,propane, butane, butylene, butadiene and acetylene. A suitable methodfor forming amorphous carbon layers is described in U.S. Pat. No.6,573,030 B1, issued to Fairbairn et al., on Jun. 3, 2003, the entiredisclosure of which is incorporated herein by reference. In addition,the amorphous carbon may be doped. A suitable method for forming dopedamorphous carbon is described in U.S. patent application Ser. No.10/652,174 to Yin et al., now U.S. Pat. No. 7,105,431, issued Sep. 12,2006, the entire disclosure of which is incorporated herein by referenceand made part of this specification. Spin-on-coating processes may beused to form photodefinable layers, such as resist layers.

In addition to selecting appropriate materials for the various layers,the thicknesses of the layers may be chosen for compatibility with etchchemistries and process conditions to be employed. By way ofnon-limiting example, when transferring a pattern from an overlyinglayer to an underlying layer by selectively etching the underlyinglayer, materials from both layers are removed to some degree, even whena selective etch chemistry is employed. Thus, the upper layer ispreferably thick enough so that it is not removed over the course of thepattern transfer. Hard mask layers may be advantageously thin so thattheir transfer or removal can be short, exposing surrounding materialsto less degradation.

FIGS. 1A-1D illustrate a portion of a partially formed embodiment of asemiconductor device 100 of the present invention. In particular, FIG.1A is partial top plan view of the semiconductor device 100. FIG. 1B isa partial cross-sectional view of the semiconductor device 100 takenalong the section line 1B-1B shown in FIG. 1A. FIG. 1C is a partialcross-sectional side view of the semiconductor device 100 taken alongthe section line 1C-1C shown in FIG. 1A. As shown in FIG. 1A, FIG. 1Band FIG. 1C are taken in planes parallel to one another. Finally, FIG.1D is a partial cross-sectional view of the semiconductor device 100taken along the section line 1D-1D shown in FIG. 1A, and is taken in aplane oriented transverse to those of FIGS. 1B and 1C.

Referring to FIG. 1A, the semiconductor device 100 may comprise a numberof laterally extending conductive traces or lines 166. The conductivelines 166 may have a tight pitch, and may comprise a conductive materialsuch as, for example, copper, aluminum, or doped polysilicon. Thesemiconductor device 100 also may comprise a number of laterallyextending conductive traces or lines 166A that do not have a tightpitch, only one of which is shown in the partial plan view of FIG. 1A.

Referring to FIG. 1B, the semiconductor device 100 may comprise asemiconductor substrate 110. The term “semiconductor substrate,” as usedherein, encompasses semiconductor dice, semiconductor wafers, partialwafers, and other bulk semiconductor substrates, such assilicon-on-insulator (SOI) substrates, silicon-on-glass (SOG) andsilicon-on-sapphire (SOS) substrates. A number of laterally separatedactive regions or features 112 may be disposed on or in an activesurface of the semiconductor substrate 110. The semiconductor substrate110 may include a plurality of additional conductive lines (not shown),such as wordlines, associated with each of the active features 112. Theschematically depicted active features 112 may comprise, for example,source, drain or gate regions of transistors, or they may compriseconductive traces or pads. In embodiments of the invention, an activefeature 112 may comprise selectively doped and undoped portions of asemiconducting material layer such as, for example, silicon,silicon-germanium, gallium arsenide, indium phosphide, and III-Vmaterials, or a conductive metal material such as copper or aluminum.

As will be appreciated by one of ordinary skill in the art, thesemiconductor substrate 110 may contain numerous other features andtopographical variations in addition to active features 112. By way of anon-limiting example of other features and topographical variations,shallow trench isolation regions 114 are depicted laterally isolatingthe region of the semiconductor substrate that includes the activefeatures 112.

As further shown in FIG. 1B, the semiconductor device 100 may comprise aplurality of electrically conductive tight pitch conductive vias 164,each of which may extend in the vertical direction of FIG. 1B between anactive feature 112 and a portion of a laterally extending tight pitchconductive line 166. In other words, each tight pitch conductive via 164may provide electrical communication between an active feature 112 and alaterally extending conductive line 166. Furthermore, as discussed infurther detail below, each tight pitch conductive via 164 may beintegrally formed with its associated tight pitch laterally extendingconductive line 166.

As best shown in FIG. 1D, the conductive vias 164 are confined in thelateral direction, and therefore, are present in the region of thesemiconductor device 100 shown in FIG. 1B, but not in FIG. 1C. In otherwords, the conductive vias 164 do not extend laterally, as do theconductive lines 166. As also shown in FIG. 1D, the active features 112also may extend a distance in a lateral direction parallel to oneanother along the semiconductor substrate 110.

In embodiments of the present invention, the active features 112,conductive vias 164, and conductive lines 166 may have a tight pitch,and may have widths of about 10 nm or less and may be spaced by adistance of about 50 nm or less (e.g., 10 nm). Thus, the pitch of thefeatures 112, conductive vias 164, and conductive lines 166 may be about60 nm or less (e.g., 20 nm). Of course, these elements may be wider ornarrower than 10 nm and may be spaced more or less than 50 nm apart fromone another without departing from the scope of the invention. Inembodiments of the invention, active features 112, conductive vias 164,and conductive lines 166 may have a width of about 35 nm, or of about 25nm.

An embodiment of a method of the present invention that may be used toform the semiconductor device 100 shown in FIGS. 1A-1D is describedbelow.

FIGS. 2A, 2B, and 2C illustrate a workpiece 180 comprising a partiallyformed semiconductor device 100. In particular, FIG. 2A is partial topplan view of the workpiece 180. FIG. 2B is a partial cross-sectionalview of the workpiece 180 taken along the section line 2B-2B shown inFIG. 2A. FIG. 2C is a partial cross-sectional side view of the workpiece180 taken along the section line 2C-2C shown in FIG. 2A. As shown inFIG. 2A, FIG. 2B and FIG. 2C are taken in planes parallel to oneanother.

Referring to FIG. 2B, the active features 112 may be formed in asemiconductor substrate 110 using methods known in the art. For example,a patterned mask layer may be formed over a surface of the semiconductorsubstrate 110, and the active features 112 may be formed in the surfaceof the semiconductor substrate 110 by doping the semiconductor substrate110 with ions through the patterned mask layer to cause the activefeatures 112 to comprise N-type and/or P-type doped semiconductormaterial regions.

As depicted in FIG. 2B, additional material layers may be formed overthe semiconductor substrate 110 and any active features 112. Forexample, a field oxide layer 111 may be formed over the substrate 110,and the active features 112 may be exposed through apertures in thefield oxide layer 111. Furthermore, a dielectric layer 116 may be formedover the active surface of the semiconductor substrate 110 (the surfaceof the semiconductor substrate 110 on or in which the active features112 have been formed), and a hard mask layer 118 may be formed over asurface of the dielectric layer 116 opposite the semiconductor substrate110.

By way of example and not limitation, the dielectric layer 116 maycomprise what is commonly referred to in the art as an inter-leveldielectric (ILD). The dielectric layer 116 may comprise any suitableelectrical insulator including, as non-limiting examples, a high densityplasma (HDP) oxide material, borophosphosilicate glass (BPSG),decomposed tetraethyl-ortho-silicate (TEOS), doped silicon dioxide(SiO₂), undoped silicon dioxide, spin-on glass, and low-k dielectrics,such as fluorinated glass. The dielectric layer 116 optionally may beplanarized using a polishing or planarization process (e.g., mechanicalpolishing, chemical-mechanical polishing (CMP), etc.) to remove or shaveoff any portions of the dielectric layer 116 that protrude outwardly dueto underlying topography before forming the hard mask 118 thereover.

As particular non-limiting examples, the dielectric layer 116 maycomprise heavily doped BPSG or lightly doped BPSG. In order to maintainverticality of openings that will eventually be formed by etchingthrough the dielectric layer 116 to form the conductive vias 164 (FIG.1B) therein, it may be desirable that the dielectric layer 116 be formedof heavily doped and graded BPSG to stimulate faster etch rates near thebottom of the BPSG (the bottom relative to the orientation of thefigures). It has been shown that the etch rate of BPSG may be at leastpartially related to the concentration of a dopant therein. Therefore,the concentration of the dopant in the BPSG may be configured to exhibita gradient in a direction from the top of the BPSG to the bottom of theBPSG that will cause the etch rate to be slower at the top of the BPSGrelative to the bottom of the BPSG. As the regions of the sidewalls ofthe BPSG within the openings near the top of the BPSG will be exposed toan etchant for a longer period of time relative to the regions near thebottom of the BPSG during an etching process, the verticality of theopenings may be maintained as the openings are etched into the BPSG fromthe top of the BPSG toward the bottom thereof by causing the regions ofthe sidewalls of the BPSG within the openings near the bottom of theBPSG to exhibit a higher etch rate.

Hard mask 118, which may serve as an etch stop layer, may comprise anysuitable mask material known to one of ordinary skill in the art. Asnon-limiting examples, the hard mask 118 may comprise silicon nitride(Si₃N₄), silicon carbide (SiC) (e.g., materials sold under the tradenameBLOk by Applied Materials of Santa Clara, Calif.), silicon carbonnitride (SiCN), silicon-rich oxide, silicon oxynitride, aluminum oxide(Al₂O₃), or the like. Optionally, where process conditions permit, anantireflective coating (ARC) (not shown) also may be formed directlyabove the hard mask 118, directly below the hard mask 118, or bothdirectly above and below the hard mask 118. Such antireflective coatingsmay comprise, for example, a dielectric antireflective coating (DARC),which may comprise a material such as, for example, silicon-rich siliconoxynitride, or a bottom antireflective coating (BARC), which maycomprise a material such as, for example, that sold under the tradenameDUV 112 by Brewer Science of Rolla, Mo.

As shown in FIGS. 2A and 2B, an aperture 128 may be formed through thehard mask 118 over a region on the dielectric layer 116 in which it isdesired to form the conductive vias 164 (FIG. 1B). The aperture 128 maybe formed in the hard mask 118 using, for example, opticalphotolithography, electron beam lithography, ion beam lithography,nano-imprint lithography, or any other suitable process. As shown inFIG. 2A, the aperture 128 may have a generally rectangular shape. Insome embodiments, the aperture 128 may have dimensions (e.g., a lengthand a width) that may be defined by the resolution of conventionalphotolithographic processes. For example, in some embodiments, theaperture 128 may have at least one dimension (e.g., a width) that isapproximately the minimum feature size obtainable using conventionalphotolithographic processes.

As one particular non-limiting example of a method that may be used toform the aperture 128 in the hard mask 118, a layer of photoresistmaterial (not shown) may be formed over the surface of the hard mask 118(and any BARC layer formed thereover). The photoresist material maycomprise any suitable photoresist material known to one of ordinaryskill in the art, including, but not limited to, a photoresistcompatible with 13.7-nanometer (nm), 157-nm, 193-nm, 248-nm or 365-nmwavelength systems, 193-nm wavelength immersion systems or electron beamlithographic systems. Examples of suitable photoresist materialsinclude, but are not limited to, argon fluoride (ArF) sensitivephotoresist, i.e., photoresist suitable for use with an ArF lightsource, and krypton fluoride (KrF) sensitive photoresist, i.e.,photoresist suitable for use with a KrF light source. ArF photoresistsmay be used with photolithography systems utilizing relatively shortwavelength light, e.g., 193 nm. KrF photoresists may be used with longerwavelength photolithography systems, such as 248 nm systems.

Known processes (e.g., photolithographic exposure and developmentprocesses, etc.) may then be used to pattern the layer of photoresistmaterial to form an aperture (not shown) therein to expose a portion ofthe hard mask 118 through the photoresist material. Once the aperturehas been formed in the layer of photoresist material overlying the hardmask 118, the pattern in the photoresist layer may be transferred to thehard mask 118. In other words, the exposed region of hard mask 118 maybe removed to create the aperture 128 in the hard mask 118, as depictedin FIGS. 2A and 2B. Removal of the exposed region of the hard mask 118to form the aperture 128 may be effected by any suitable process,including, without limitation, wet or dry etch processes or otherwise,as known in the art. In embodiments of the present invention, removalmay be effected by an anisotropic (or highly directional) etch. Dryetching may, in some embodiments, provide enhanced control of thecritical dimensions. Examples of anisotropic etches include, but are notlimited to, etches using a HBr/Cl plasma, Cl₂/HBr, or a fluorocarbonplasma having fluorocarbon plasma etch chemistries including, but notlimited to, CF₄, CFH₃, CF₂H₂ and CF₃H. The etch may include a physicalcomponent and may also include a chemical component and may be, e.g., areactive ion etch (RIE), such as a Cl₂/HBr etch. An etch may beperformed, by way of non-limiting example, using an LAM TCP9400 etchchamber and flowing about 0-50 sccm Cl₂ and about 0-200 sccm HBr atabout 7-60 mTorr pressure with about 300-1000 W top power and about50-250 W bottom power. By way of a further non-limiting example, an AME5000 etch chamber may also accomplish similar etches, although adifferent recipe and settings may be required.

The etching process used to remove the exposed portion of hard mask 118may stop on, or not consume too much of, the dielectric layer 116. Afterforming the aperture 128 in the hard mask 118, any remaining portion ofthe layer of photoresist material may be removed from the substrate.

As will be better understood after a review of later portions of thisspecification, the hard mask 118 may function as an etch stop layer andmay be used to prevent material of underlying layers, films, orstructures from being undesirably removed during one or more subsequentetching processes. Therefore, the thickness of the hard mask 118 may besufficiently thick to survive any subsequent etching processes, but notso thick as to create stepped topography therein.

FIG. 3 is a partial cross-sectional view similar to that of FIG. 2Billustrating an additional workpiece 182 that may be formed from theworkpiece 180 (FIGS. 2A-2C) by forming (e.g., depositing) additionalmaterial layers over the first hard mask 118, to fill second aperture128 and further fabricate the semiconductor device 100 (FIGS. 1A-1C).Additional layers may include, for example, another dielectric layer 134and another hard mask 136. By way of example and not limitation, theanother dielectric layer 134 may be from about fifty nanometers (50 nm)to about two hundred nanometers (200 nm) in thickness, depending on thedesired final height or thickness of the conductive lines 166.

The dielectric layer 134 may be of similar or different composition tothat of dielectric layer 116. As a non-limiting example, the insulatingdielectric layer 134 may comprise TEOS having a dielectric constant (K)of about 3.9. If copper metallization is to be employed as a conductoror interconnect in the semiconductor device 100 (FIGS. 1A-1C), afluorinated glass, having a dielectric constant (K) of about 2.6 to 2.3,may be employed. Other suitable materials may also be employed. The hardmask 136 may comprise, for example, a transparent carbon (TC) material.

Referring to FIG. 4, tight pitch spacers 152 may be formed over the hardmask 136. The tight pitch spacers 152 may be formed using methods knownin the art, such as, for example, those disclosed in U.S. Pat. No.7,115,525 to Abatchev et al. and U.S. patent application Ser. No.11/511,541, filed Aug. 29, 2006, and entitled “Semiconductor DevicesIncluding Fine Pitch Arrays with Staggered Contacts and Methods forDesigning and Fabricating the Same,” the entire disclosure of each ofwhich is incorporated herein by this reference. Optionally, an ARC layer138 may be provided between the spacers 152 and the hard mask 136, asshown in FIG. 4. The ARC layer 138 may comprise a DARC layer, and maycomprise any suitable DARC material known to one of ordinary skill inthe art including, but not limited to, a silicon-rich oxynitride, or anyother DARC coating.

Another non-limiting example of a process that may be used to form thetight pitch spacers 152 comprises a low-temperature atomic layerdeposition (ALD) process performed in one or more cycles to achieve adesired spacer material thickness. Briefly summarized, a layer ofphotoresist material is deposited over the hard mask 136 (and theoptional ARC layer 138) and patterned using standard photolithographyprocesses to form a plurality of openings in the layer of photoresistmaterial that defines a plurality of lines therebetween each having awidth of about sixty nanometers (60 nm) or more. After forming thealternating lines and openings in the layer of photoresist material, thewidth of the lines may be reduced (and the width of the openingsincreased) using a so-called “resist trimming” or “carbon trimming”process. Such processes are known in the art. A relatively thin layer ofspacer material may be deposited over the patterned layer of photoresistmaterial. For example, a low temperature atomic layer deposition (ALD)process may be used to deposit spacer material over the photoresistmaterial. The spacer material may be blanket deposited in a manner suchthat it conforms to the features of any exposed surfaces of theworkpiece including the sidewalls of the lines formed from thephotoresist material. As a non-limiting example, a thin layer of silicondioxide (SiO₂) spacer material may be deposited in an ALD chamber at atemperature of between about 75° C. and about 100° C. in an atmospherecomprising hexachlorodisilane (HSD), H₂O, and pyridine (C₅H₅N). Thepyridine may serve as a catalyst to enable film growth at the lowertemperatures. Each ALD cycle may comprise a pulse from about 2 secondsto about 5 seconds of a mixture of HSD and pyridine. This may befollowed by an argon pulse lasting from about 5 seconds to about 10seconds. The surface may then be pulsed from about 2 seconds to about 5seconds with a mixture of H₂O and pyridine, and may be followed byanother Argon pulse lasting from about 5 seconds to about 10 seconds.The resulting deposition rate may be about 2.5 Å/cycle. The aboveprocess may result in a substantially stoichiometric SiO₂ film with lowbulk contamination, which may include C (<2 at %), H (<22 at %), N (<1at %), and/or Cl (<1 at %).

In additional embodiments, the spacer material may be formed by anysuitable process that does not destroy the underlying photoresistmaterial, including, but not limited to, plasma-enhanced or assistedchemical vapor deposition (PECVD) or low-temperature and conformaldeposition techniques.

After depositing the layer of spacer material, a so-called “spacer etch”may be conducted to form the tight pitch spacers 152 shown in FIG. 4from the layer of spacer material. As known to those of ordinary skillin the art, a spacer etch is a highly anisotropic etching process. Thespacer etch process may include a physical component, and may alsoinclude a chemical component. The spacer etch process may be, forexample, a reactive ion etching (RIE) process. As one particularnon-limiting example, the spacer etch may be performed using, forexample, carbon tetrafluoride (CF₄) and argon (Ar) plasma for an oxidespacer material. After a spacer etch is performed, it may leave behind apattern of elongate spacers having an effectively reduced pitch. The ARClayer 138 or the hard mask 136 may act as a partial etch stop layerduring the spacer etch process. The spacer etch process removes therelatively vertically thin portions of the layer of spacer material, butleaves behind vertically thick portions of the layer of spacer material.In general, spacer material deposited on laterally extending surfaces ofthe workpiece 184 is removed during the spacer etch, while at least aportion of the spacer material deposited on vertically extendingsurfaces (such as, for example, the sidewalls of the lines previouslyformed from the photoresist material) remains on the workpiece 184. Theresult as illustrated in FIG. 4 includes individual tight pitch spacers152.

Any remaining portions of the photoresist material and exposed portionsof the ARC layer 138 may be removed by suitable processes, leavingbehind the spacers 152. The processes that are used depend, of course,upon the material or materials from which photoresist and the ARC layer138 are formed.

Other methods for forming tight pitch features, like the tight pitchspacers 152 shown in FIG. 4, are known in the art and may be employed inembodiments of the present invention. By way of example and notlimitation, methods such as those disclosed in United States PatentPublication No. 2007/0161251 A1, filed Mar. 1, 2007, and entitled “PitchReduced Patterns Relative to Photolithography Features,” the entiredisclosure of which is incorporated herein by this reference, may beused to form tight pitch spacers 152.

Referring to FIG. 5, an etching process (e.g., an anisotropic dryetching process) may be used to transfer the pattern of the spacers 152to the hard mask 136 and form the workpiece 186 shown in FIG. 5. Inother words, the hard mask 136 may be etched using the spacers 152 as amask.

Referring to FIGS. 6A and 6B, another etching process, such as a highdensity plasma etch, may then be performed using the spacers 152 (FIG.5), hard mask 136, and the underlying hard mask 118 as mask structuresto form tightly pitched trenches 158 and self-aligned contact holes 160,expose the underlying active features 112, and form the workpiece 188shown in FIGS. 6A and 6B. FIG. 6A is a partial cross-sectional view ofthe workpiece 188 taken in the plane of section line 2B-2B shown in FIG.2A, and FIG. 6B is a partial cross-sectional view of the workpiece 188taken in the plane of section line 2C-2C shown in FIG. 2A.

Removal of material from the dielectric layer 134 and the dielectriclayer 116 may be effected with a suitable etchant or combination ofetchants. The removal process may also substantially simultaneouslyremove the remaining material of the spacers 152 and the underlying ARClayer 138). For example, a plasma formed from a mixture of C₄F₈, C₄F₆,and O₂ may be used to remove material from dielectric layer 134 anddielectric layer 116 if dielectric layer 134 and dielectric layer 116comprise silicon dioxide, as such a plasma removes silicon dioxide withselectivity over silicon nitride, from which one or both of the hardmask 118 and the hard mask 136 may be formed.

The etch may be an oxide trench and self-aligned contact etch. In someembodiments, the etch may be a dry etch. The etch may be straight inprofile so that contact holes 160 created in communication with features112 are not pinched, e.g., at the bottom, middle, and/or top. The etchmay have a high selectivity for the materials of dielectric layers 116and 134 over the material of hard mask 118, such that a relatively thinfirst hard mask 118 is capable of stopping the etch. An anisotropic dryetch, used in conjunction with dielectric layer 116 of heavily doped andgraded BPSG, may be used to form contact holes 160 with high sidewallverticality, as previously described herein.

The lateral dimension across the bottom end of each contact hole 160 maybe large enough (e.g., about 30 nm) to minimize contact resistancebetween a conductive via 164 (FIG. 1B) subsequently formed within eachcontact hole 160 and its feature 112. Further, the alignment of contactholes 160 to features 112 is significant. For a thirty-five-nanometer(35-nm) feature size, the alignment tolerance may be less than abouttwelve nanometers (12 nm), while for a twenty-five-nanometer (25-nm)feature size, it may be less than about eight nanometers (8 nm).

Any remaining portions of the spacers 152, the ARC layer 138, and/or thehard mask 136 may be removed and the workpiece 188 may be cleaned (e.g.,by suitable stripping and cleaning processes) prior to filling thetrenches 158 and the contact holes 160 with conductive material to formthe conductive lines 166 and the conductive vias 164.

After forming the tight pitch trenches 158 and corresponding tight pitchcontact holes 160 in a self-aligned manner, one or more conductivematerials may be introduced into the trenches 158 and contact holes 160to form the conductive lines 166 and the conductive vias 164,respectively, of the at least partially formed semiconductor device 100shown in FIGS. 1A-1D. By way of example and not limitation, one or moreconductive materials may be provided within the trenches 158 and thecontact holes 160 by chemical vapor deposition (CVD), physical vapordeposition (PVD), electroplating, electroless plating, or by acombination of such processes.

In this manner, the tight pitch conductive vias 164 and tight pitchconductive lines 166 (FIGS. 1A-1D) are formed substantially concurrentlyin a self-aligned manner, and there is no need for alignment tolerance.Furthermore, the tight pitch conductive vias 164 and tight pitchconductive lines 166 are integrally formed with one another duringfabrication. As a result, there is no identifiable boundary between eachof the corresponding conductive vias 164 and conductive lines 166.

As one non-limiting example, an initial film or seed layer (not shown)of conductive material may be formed over the exposed surfaces withineach trench 158 and contact hole 160, including over surfaces of theactive features 112 and the hard mask 118, using an electroless platingprocess. Thereafter, a conductive material may be electroplated to orover the seed layer to fill each trench 158 and contact hole 160 withthe conductive material.

By way of non-limiting example only, an initial film may comprise alayer of seed material (e.g., titanium nitride (TiN), etc.), which mayenhance or facilitate the adhesion of a bulk conductive materialcomprising tungsten to the surfaces within the contact holes 160 and thetrenches 158. Other conductive materials, such as copper, aluminum andnickel are also suitable for use as conductive materials within thecontact holes 160 and the trenches 158.

In other embodiments, a seed layer may be formed from a material (e.g.,tungsten (W), tungsten nitride (WN), a metal silicide, tantalum nitride(TaN) (for use with copper (Cu), etc.) that acts as both an adhesionlayer and a barrier layer (e.g., to prevent diffusion or interdiffusion,to reduce contact resistance, etc.) between material at the surfaces oftrenches 158 and contact holes 160 and the bulk conductive material(e.g., aluminum (Al), copper (Cu), etc.). In view of the extremely smalldimensions of the tight pitch trenches 158 and the tight pitch contactholes 160, the seed layer may be extremely thin (e.g., about 5 nm).Known processes, including, but not limited to, pulsed chemical vapordeposition (CVD) and atomic layer deposition (ALD) techniques may beused to form the seed layer as well as the bulk conductive material. Asthe lateral dimensions of trenches 158 and contact holes 160 arereduced, the use of ALD techniques may be required.

Optionally, adjacent conductive lines 166 may be physically andelectrically separated from one another by removing any excessconductive material from the workpiece. Without limiting the scope ofthe present invention, such removal may be effected by way of apolishing or planarization process (e.g., mechanical polishing,chemical-mechanical polishing (CMP), etc.) to remove the conductivematerial with at least some selectivity over (i.e., at a faster ratethan) the material of dielectric layer 134. Alternatively, a timed,selective etch process may be employed to remove excess conductivematerial.

Processes and structures according to embodiments of the presentinvention may facilitate the use of lithography apparatuses to fabricatesemiconductor devices in a manner not possible with conventionaltechniques. For example, lithography apparatuses have alignmenttolerance limits that are typically a fraction (e.g., one-third) of aminimum feature size with which they may be employed. By use of theembodiments of the present invention, however, lithography apparatusesmay be employed in fabricating features that will align with features ofmuch smaller dimensions and alignment tolerances, effectively increasingthe alignment tolerances of lithography apparatus.

CONCLUSION

In embodiments of the present invention, a semiconductor structureincludes a tight pitch conductive line and contact aligned with anactive area feature. The line and contact may be formed at the same timefrom the same material so that they comprise a single integrally formedstructure. By creating the trench for the conductive line and thecontact hole at the same time using a combination of superimposed maskstructures, a tight pitch and alignment therebetween may be enabled.Fabrication acts and, thus, time and materials are saved. Further, asthe contact hole is simultaneously formed with the trench for theconductive line, any potential for misalignment of the line and itsassociated contact is minimized in at least one direction. As usedherein, the term “semiconductor structure” includes wafers and otherbulk semiconductor substrates, partial wafers, groups of dice, andsingulated dice. Such semiconductor structures comprise both packagedand unpackaged integrated circuits, as well as in-process semiconductorstructures.

Embodiments of the present invention include methods for fabricatingsimultaneously formed tight pitch contact holes and line trenches in oron semiconductor structures. The tight pitch contact holes and linetrenches may be formed using various methods including, for example,pitch doubling (or pitch multiplication) processes, double patterning,double exposure, maskless photolithography, and advanced fine linelithography. Such methods may employ a methodology, in which trenchesand associated discrete, laterally isolated apertures are formed at atight pitch to extend through two or more different fabrication levels,or elevations, of a semiconductor structure. The trenches and aperturesare then filled with conductive material. In some embodiments of themethods, a mask is provided with one or more apertures at locationswhere the contact plugs are to be formed, trenches are formed to extendthereover and communicating contact holes are created therethrough, andthe conductive lines and contact plugs are subsequently simultaneouslyformed. When such techniques are employed, it removes the necessity ofadditional acts to form and align the conductive lines with the contactplugs.

Embodiments of the invention include intermediate structures that areformed during the performance of such methods. Embodiments of theinvention may include, but are not limited to, intermediatesemiconductor structures, which may include material layers that servemultiple functions. In a non-limiting example, a single material layermay serve as an etch stop, a hard mask, and a polish stop at differentstages of a fabrication process.

Although the foregoing description contains many specifics, these shouldnot be construed as limiting the scope of the present invention, butmerely as providing illustrations of some embodiments. Other embodimentsof the invention may be devised which are encompassed within the scopeof the present invention. Features and elements from differentembodiments may be employed in combination. The scope of the inventionis, therefore, indicated and limited only by the appended claims andtheir legal equivalents, rather than by the foregoing description. Alladditions, deletions and modifications to embodiments of the inventionas disclosed herein which fall within the meaning and scope of theclaims are to be embraced thereby.

What is claimed is:
 1. A method of fabricating a semiconductorstructure, the method comprising: forming a plurality of tight pitchtrenches and a plurality of tight pitch contact holes in a singlematerial removal process; forming a plurality of tight pitch conductivelines and a plurality of tight pitch conductive contacts by introducingconductive material into each tight pitch trench of the plurality oftight pitch trenches and each tight pitch contact hole of the pluralityof tight pitch contact holes.
 2. The method of claim 1, wherein formingthe plurality of tight pitch trenches and the plurality of tight pitchcontact holes in the single material removal process comprise etchingthrough two or more material layers in a single, continuous etchingprocess.
 3. The method of claim 2, further comprising composing at leastone material of the two or more material layers to exhibit a variableetch rate, through a thickness of the at least one material, withrespect to an etchant.
 4. The method of claim 1, wherein etching throughthe two or more material layers in a single, continuous etching processcomprises: etching through at least one material layer of the two ormore material layers to form the plurality of tight pitch trenches inthe at least one material layer; and etching through at least anothermaterial layer of the two or more material layers to form the pluralityof tight pitch contact holes in the at least another material layer. 5.The method of claim 4, wherein the plurality of tight pitch trenches arenot disposed in the at least another material layer.
 6. The method ofclaim 4, wherein etching through at least another material layer of thetwo or more material layers to form the plurality of tight pitch contactholes comprises etching through an aperture in a mask.
 7. The method ofclaim 6, wherein etching through the aperture in the mask comprisesetching through a dielectric material disposed within the aperture inthe mask.
 8. The method of claim 7, further comprising forming theplurality of tight pitch contact holes to extend through the dielectricmaterial and through the aperture in the mask.
 9. The method of claim 6,wherein etching through the aperture in the mask comprises etchingthrough an aperture in a hard mask.
 10. The method of claim 1, whereinintroducing conductive material into each tight pitch trench of theplurality of tight pitch trenches and each tight pitch contact hole ofthe plurality of tight pitch contact holes comprises filling at least aportion of each tight pitch trench of the plurality of tight pitchtrenches and at least a portion of each tight pitch contact hole of theplurality of tight pitch contact holes with conductive material in asingle, continuous process.
 11. The method of claim 10, furthercomprising integrally forming each tight pitch conductive contact of theplurality of tight pitch conductive contacts with a respective tightpitch conductive line of the plurality of tight pitch conductive lines.12. The method of claim 1, further comprising forming a plurality oftight pitch spacers, and using the tight pitch spacers as maskstructures while forming the plurality of tight pitch trenches and theplurality of tight pitch contact holes in the single material removalprocess.
 13. The method of claim 12, wherein forming the plurality oftight pitch spacers comprises at least one of a pitch multiplicationprocess, a double-patterning process, a double exposure process, amaskless photolithography process, and an advanced fine line lithographyprocess.
 14. A method of forming a semiconductor device, comprising:forming a first volume of material over tight pitch features on asubstrate; forming a mask having an aperture over the first volume ofmaterial; forming a second volume of material over the mask; in a singlecontinuous etching process, etching through the second volume ofmaterial to form tight pitch trenches in the second volume of material,and etching through the aperture in the mask and through the firstvolume of material to form tight pitch contact holes extending throughthe aperture in the mask and through the first volume of material to thetight pitch features; and filling the tight pitch contact holes andtight pitch trenches with conductive material to form tight pitchconductive contacts and tight pitch conductive lines, each tight pitchconductive contact electrically contacting a respective feature of thetight pitch features on the substrate and integrally formed with arespective tight pitch conductive line of the tight pitch conductivelines.
 15. The method of claim 14, further comprising forming tightpitch spacers over the second volume of material and using the tightpitch spacers as mask structures during the single continuous etchingprocess.
 16. The method of claim 15, wherein forming tight pitch spacersover the second volume of material comprises at least one of a pitchmultiplication process, a double-patterning process, a double exposureprocess, a maskless photolithography process, and an advanced fine linelithography process.
 17. The method of claim 14, wherein the tight pitchtrenches are not disposed in the first volume of material.
 18. Themethod of claim 14, further comprising forming the first volume ofmaterial and the second volume of material to have at leastsubstantially the same composition.
 19. The method of claim 14, whereinfilling the tight pitch contact holes and tight pitch trenches withconductive material to form tight pitch conductive contacts and tightpitch conductive lines comprises filling at least a portion of eachtight pitch trench and at least a portion of each tight pitch contacthole with conductive material in a single, continuous process.
 20. Themethod of claim 14, wherein the tight pitch features are selected fromgroup consisting of transistor sources regions, transistor drainregions, and transistor gate regions.